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    "url": "https://kurtzersa.com/services/solder-wiki/convection-reflow-systems",
    "title": "ersa reflow",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "ersa-reflow",
        "url": "https://kurtzersa.com/services/solder-wiki/convection-reflow-systems",
        "checked": "2026-10-08",
        "scope": "Manufacturer supports heater/circulated air or nitrogen/cooling/control/transport decomposition. Selected batch/manual layout is inference; industrial conveyor not mandatory for one-off hypothesis.",
        "origin_file": "proposals/2026-10-08-discovery/materials/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://qman.elektrisola.com/ru/Enamelled-Wire/Info",
    "title": "elektrisola wire",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "elektrisola-wire",
        "url": "https://qman.elektrisola.com/ru/Enamelled-Wire/Info",
        "checked": "2026-10-08",
        "scope": "Manufacturer describes staged drawing dies, protective anneal, enamel application, cure, lubrication/tension/spooling. Does not prove our manual equipment or fine-wire grade.",
        "origin_file": "proposals/2026-10-08-discovery/materials/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://api.grundfos.com/literature/Grundfosliterature-6253516.pdf",
    "title": "grundfos pump",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "grundfos-pump",
        "url": "https://api.grundfos.com/literature/Grundfosliterature-6253516.pdf",
        "checked": "2026-10-08",
        "scope": "Manufacturer manual exposes piston/slide and inlet/outlet valve leakage. Our hand-driven water pump is architecture inference, not claimed manufacturer implementation or vacuum performance.",
        "origin_file": "proposals/2026-10-08-discovery/materials/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.syensqo.com/en/brands/solef-pvdf/li-ion-batteries",
    "title": "syensqo pvdf",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "syensqo-pvdf",
        "url": "https://www.syensqo.com/en/brands/solef-pvdf/li-ion-batteries",
        "scope": "Manufacturer supports PVDF electrode binder use and NMP solubility. Does not establish our monomer manufacture, polymerization recipe or phone-cell grade.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.molchem.uni-freiburg.de/research/li-ion/li-ion-intro",
    "title": "freiburg electrolyte",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "freiburg-electrolyte",
        "url": "https://www.molchem.uni-freiburg.de/research/li-ion/li-ion-intro",
        "scope": "University research group identifies typical LiPF6 in cyclic/linear alkyl carbonates. Does not specify selected blend/concentration/additives or synthesis/purity.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.emdgroup.com/en/expertise/displays/solutions/oled-display-materials.html",
    "title": "emd oled",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "emd-oled",
        "url": "https://www.emdgroup.com/en/expertise/displays/solutions/oled-display-materials.html",
        "scope": "Manufacturer describes vacuum thermal evaporation, highly purified materials and transport/matrix/blocking functions. RGB feed separation and our selected stack are engineering inference; molecules and exact recipe unknown.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.lesker.com/newweb/deposition_materials/pdf/13-153-ma-ds-cmm-capabilities-datasheet.pdf",
    "title": "lesker oxide",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "lesker-oxide",
        "url": "https://www.lesker.com/newweb/deposition_materials/pdf/13-153-ma-ds-cmm-capabilities-datasheet.pdf",
        "scope": "Manufacturer describes mixed oxide target powder mixing/calcination/phase and size analysis/pressing/sintering/finishing/cleaning. Does not validate our ITO ratio or homemade equipment.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.cnfusers.cornell.edu/node/147",
    "title": "cornell ito",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cornell-ito",
        "url": "https://www.cnfusers.cornell.edu/node/147",
        "scope": "University facility lists ITO sputtering and oxygen introduction. Our ceramic target architecture is a separate selected hypothesis; no imported tool allowed.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.linde-gas.com/products-and-services/gases/atmospheric-gases",
    "title": "linde atmospheric",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "linde-atmospheric",
        "url": "https://www.linde-gas.com/products-and-services/gases/atmospheric-gases",
        "scope": "Manufacturer supports cryogenic separation/purification of oxygen, nitrogen and argon from air. Does not supply compressors, refrigeration, independent gas assay or one-off scaling.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://ig.linde-gas.com/hydrogen-production-processing",
    "title": "linde hydrogen",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "linde-hydrogen",
        "url": "https://ig.linde-gas.com/hydrogen-production-processing",
        "scope": "Manufacturer identifies electrolysis and later hydrogen cleaning to high purity. Alkaline-cell layout is inference; source does not prove first electrode/separator/power/grade.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.corning.com/worldwide/en/innovation/materials-science/glass/how-glass-made.html",
    "title": "corning glass",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "corning-glass",
        "url": "https://www.corning.com/worldwide/en/innovation/materials-science/glass/how-glass-made.html",
        "scope": "Manufacturer supports silica/sodium carbonate/calcium carbonate batch and distinct glass/strengthening processes. No formulation is adopted, no generic glass qualification for flagship phone.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://ntrs.nasa.gov/api/citations/19860006910/downloads/19860006910.pdf?attachment=true",
    "title": "nasa polyimide",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "nasa-polyimide",
        "url": "https://ntrs.nasa.gov/api/citations/19860006910/downloads/19860006910.pdf?attachment=true",
        "scope": "NASA primary memorandum supports diamine/dianhydride and polyamic-acid/polyimide process states. Exact selected monomers/solvent and film conditions remain open; not a commercial film recipe.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "retrieval_limit": "Search-index primary PDF excerpt inspected; direct full PDF fetch returned 403. Full chemistry claim must be rechecked before source-checked page status.",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.ise.fraunhofer.de/en/business-areas/electrical-energy-storage/production-technology-for-batteries/battery-cell-production.html",
    "title": "fraunhofer cell",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "fraunhofer-cell",
        "url": "https://www.ise.fraunhofer.de/en/business-areas/electrical-energy-storage/production-technology-for-batteries/battery-cell-production.html",
        "scope": "Institution describes ultrasonic tab welding, pouch forming/sealing, vacuum filling/wetting, formation under pressure, degassing/reseal and cycling. Electrode slurry implementation and equipment construction are still engineering inference.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.global.dnp/en/our-business/innovation/battery-pouch/",
    "title": "dnp pouch",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "dnp-pouch",
        "url": "https://www.global.dnp/en/our-business/innovation/battery-pouch/",
        "scope": "Manufacturer supports pouch sealing/insulation/heat/corrosion functions, not complete laminate/tab-seal recipe or our grade.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.chem.ucalgary.ca/courses/351/laboratory/353equipment.html",
    "title": "calgary lab glass",
    "title_verified": false,
    "topic": "materials",
    "provenance": [
      "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "calgary-lab-glass",
        "url": "https://www.chem.ucalgary.ca/courses/351/laboratory/353equipment.html",
        "scope": "University lab apparatus identifies distillation flask/head/condenser/receiver and ground-glass joint connections. Supports alternative architecture only; does not solve our first glass feed or joint precision/purity bootstrap.",
        "checked": "2026-10-09",
        "evidence_status": "selective-primary-source-sanity-check",
        "retrieval_limit": "Search-index university page excerpt inspected; direct page fetch returned 502. Architecture candidate remains unselected and blocked.",
        "origin_file": "proposals/2026-10-08-discovery/materials/breadth-pass-03-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.st.com/content/st_com/en/about/innovation-and-technology/mems.html",
    "title": "MEMS process technology",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json",
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json",
      "proposals/2026-10-08-discovery/research/mems/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "st-mems-process",
        "url": "https://www.st.com/content/st_com/en/about/innovation-and-technology/mems.html",
        "title": "MEMS process technology",
        "retrieval": "Full page read",
        "supports": [
          "Micromachined silicon mechanical structures and CMOS readout are different requirements.",
          "An industry example uses polysilicon surface micromachining, cavity sealing, and separate MEMS/ASIC dice in one package."
        ],
        "does_not_establish": [
          "An accessible complete ThELMA recipe",
          "The selected proposal reproduces ST devices",
          "A silicon cap is the only suitable cap material",
          "Exact moving geometry, layer dimensions, cavity atmosphere or package qualification"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      },
      {
        "id": "frontier-st-dual-chip",
        "title": "MEMS manufacturing technology",
        "url": "https://www.st.com/content/st_com/en/about/innovation-and-technology/mems.html",
        "type": "manufacturer primary architecture description",
        "checked": "2026-10-08",
        "supports": [
          "Polysilicon surface micromachining is a relevant inertial-sensor architecture; mechanical and readout dice remain separate physical responsibilities."
        ],
        "affected_outputs": [
          "patterned-inertial-wafer",
          "accelerometer"
        ],
        "does_not_establish": [
          "A reproducible proprietary ThELMA recipe or that this open single-layer adapted candidate reaches modern handset performance."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      },
      {
        "id": "mems-st-thelma",
        "title": "MEMS manufacturing: ThELMA and integration",
        "url": "https://www.st.com/content/st_com/en/about/innovation-and-technology/mems.html",
        "type": "manufacturer primary process architecture",
        "read_scope": "ThELMA surface micromachining and separate MEMS/ASIC integration",
        "supports": [
          "Polysilicon surface-micromachining architecture",
          "Separate MEMS and ASIC dice"
        ],
        "does_not_establish": [
          "Public reproducible full proprietary recipe",
          "Compatibility of our generic wafer/etch route",
          "An obligatory vacuum level for every accelerometer"
        ],
        "checked": "2026-10-08",
        "origin_file": "proposals/2026-10-08-discovery/research/mems/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified",
    "prior_status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.st.com/resource/en/application_note/an4508-parameters-and-calibration-of-a-lowg-3axis-accelerometer-stmicroelectronics.pdf",
    "title": "AN4508: Parameters and calibration of a low-g 3-axis accelerometer",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "st-accelerometer-calibration",
        "url": "https://www.st.com/resource/en/application_note/an4508-parameters-and-calibration-of-a-lowg-3axis-accelerometer-stmicroelectronics.pdf",
        "title": "AN4508: Parameters and calibration of a low-g 3-axis accelerometer",
        "retrieval": "Full PDF text read",
        "supports": [
          "Supply, bandwidth, scale, offset, temperature, noise and axis relationships matter to accelerometer acceptance.",
          "Stationary orientations relative to gravity can inform accelerometer calibration."
        ],
        "does_not_establish": [
          "A gyro or magnetometer calibration recipe",
          "Final project acceptance targets",
          "Absolute local gravitational acceleration accuracy without independent evidence",
          "Manufacture of the first calibrated instrument"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.siltronic.com/fileadmin/investorrelations/Pr%C3%A4sentation/Siltronic_Fact_Book_2017.pdf",
    "title": "Siltronic Fact Book 2017",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "siltronic-wafer-states",
        "url": "https://www.siltronic.com/fileadmin/investorrelations/Pr%C3%A4sentation/Siltronic_Fact_Book_2017.pdf",
        "title": "Siltronic Fact Book 2017",
        "retrieval": "Full PDF text read; wafer process figures also represented in search extraction",
        "supports": [
          "Polysilicon, crystal ingot and finished wafer are distinct physical states.",
          "Czochralski crystal pulling precedes slicing, lapping, cleaning/etching and polishing in the selected path."
        ],
        "does_not_establish": [
          "A first seed crystal route",
          "A first high-purity quartz crucible route",
          "Chip-specific wafer requirements",
          "Equipment recipes",
          "Electronics-free crystal grower control"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://reports.wacker.com/2022/annual-report/sustainable-solutions/purity-is-our-recipe-for-success.html",
    "title": "Purity Is Our Recipe for Success",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json",
      "proposals/2026-10-08-discovery/research/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "wacker-siemens-refining",
        "url": "https://reports.wacker.com/2022/annual-report/sustainable-solutions/purity-is-our-recipe-for-success.html",
        "title": "Purity Is Our Recipe for Success",
        "retrieval": "Full page read",
        "supports": [
          "An industrial polysilicon path transforms metallurgical silicon through chlorosilane purification and deposition.",
          "Siemens-type deposition uses prior starter rods and requires additional handling and cleaning for semiconductor feedstock."
        ],
        "does_not_establish": [
          "A first starter rod route",
          "A complete gas/reaction/byproduct recipe",
          "An impurity acceptance specification",
          "The earliest sufficient electrical supply",
          "A complete reactor construction route"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      },
      {
        "id": "audit-wacker-polysilicon",
        "title": "Purity Is Our Recipe for Success",
        "url": "https://reports.wacker.com/2022/annual-report/sustainable-solutions/purity-is-our-recipe-for-success.html",
        "type": "manufacturer primary industrial account",
        "read_scope": "Seed-rod deposition and monocrystal conversion passages",
        "supports": [
          "Industrial polysilicon deposition onto seed rods",
          "Seed-crystal prerequisite in later crystal conversion"
        ],
        "does_not_establish": [
          "First starter rods or crystal seeds",
          "Our furnace/reactor construction",
          "Quantity, final semiconductor purity or handset qualification"
        ],
        "checked": "2026-10-08",
        "origin_file": "proposals/2026-10-08-discovery/research/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified",
    "prior_status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.wacker.com/h/en-us/medias/7416-EN.pdf",
    "title": "Wacker polysilicon production brochure",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "wacker-quartz-preview",
        "url": "https://www.wacker.com/h/en-us/medias/7416-EN.pdf",
        "title": "Wacker polysilicon production brochure",
        "retrieval": "Search-extracted production steps checked; full PDF open failed",
        "supports": [
          "Preview describes quartz plus carbon to metallurgical silicon, conversion using hydrogen chloride, then trichlorosilane distillation."
        ],
        "does_not_establish": [
          "Full document independently read",
          "Geological occurrence identification or collection sufficiency",
          "Energy requirements, electrode details or a complete reduction-furnace recipe"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://amkor.com/packaging/laminate/fccsp/",
    "title": "Flip Chip Chip Scale Package",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/sources.json",
      "proposals/2026-10-08-discovery/research/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "amkor-fccsp",
        "url": "https://amkor.com/packaging/laminate/fccsp/",
        "title": "Flip Chip Chip Scale Package",
        "retrieval": "Primary manufacturer page checked during independent package review",
        "supports": [
          "Flip-chip packaging is an applicable alternative for mobile application processors, baseband, RF and power management; package architecture cannot be ignored."
        ],
        "does_not_establish": [
          "Our wirebond hypothesis meets flagship form factor or performance",
          "A complete first flip-chip equipment/materials path",
          "The selected alternative or final device package"
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/sources.json"
      },
      {
        "id": "audit-amkor-fccsp",
        "title": "fcCSP Flip Chip CSP",
        "url": "https://amkor.com/packaging/laminate/fccsp/",
        "type": "manufacturer primary packaging account",
        "read_scope": "Package architecture and mobile use cases",
        "supports": [
          "Bump/substrate mobile packaging alternative",
          "Packaging electrical/form-factor demands matter"
        ],
        "does_not_establish": [
          "Our manufacturing route",
          "Universal requirement for all handset chips",
          "That wirebond candidate meets flagship demands"
        ],
        "checked": "2026-10-08",
        "origin_file": "proposals/2026-10-08-discovery/research/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified",
    "prior_status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://corporate.murata.com/en-us/technology/technology-platform/production-technology/green-sheet-process",
    "title": "Green Sheet Process Technology",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-murata-green-sheets",
        "title": "Green Sheet Process Technology",
        "url": "https://corporate.murata.com/en-us/technology/technology-platform/production-technology/green-sheet-process",
        "type": "manufacturer primary process description",
        "checked": "2026-10-08",
        "supports": [
          "Unfired ceramic/binder sheet state precedes electrode printing, stacking and pressing."
        ],
        "affected_outputs": [
          "capacitor-green-sheets",
          "printed-capacitor-laminate"
        ],
        "does_not_establish": [
          "Our dielectric/paste composition, equipment cleanliness, layer thickness, quantity, yield or handset qualification."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.murata.com/en-us/support/faqs/capacitor/ceramiccapacitor/conf/0002",
    "title": "Production process of multilayer ceramic capacitors",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-murata-capacitor-sequence",
        "title": "Production process of multilayer ceramic capacitors",
        "url": "https://www.murata.com/en-us/support/faqs/capacitor/ceramiccapacitor/conf/0002",
        "type": "manufacturer primary manufacturing FAQ",
        "checked": "2026-10-08",
        "supports": [
          "Cut and fired internal-electrode body precedes external electrodes, plating and measurement."
        ],
        "affected_outputs": [
          "fired-capacitor-chips",
          "multilayer-ceramic-capacitors"
        ],
        "does_not_establish": [
          "Selected atmosphere, our furnace or printing capability, electrical acceptance or a first passive instrument path."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.esda.org/esd-overview/esd-fundamentals/part-3-basic-esd-control-procedures-and-materials/",
    "title": "EOS/ESD Fundamentals Part 3",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-esda-workstation",
        "title": "EOS/ESD Fundamentals Part 3",
        "url": "https://www.esda.org/esd-overview/esd-fundamentals/part-3-basic-esd-control-procedures-and-materials/",
        "type": "professional standards association primary guidance",
        "checked": "2026-10-08",
        "supports": [
          "Worksurface, personnel grounding and common-potential bonding are separate physical obligations; ordinary insulators are not discharged merely by grounding."
        ],
        "affected_outputs": [
          "electrostatic-protection",
          "esd-dissipative-mat",
          "esd-personnel-band",
          "esd-ground-leads",
          "esd-protective-container"
        ],
        "does_not_establish": [
          "Our carbon-loaded formulations or required resistance, current limiting, earth grounding, shielding, cleanliness or device compatibility."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://pages.jh.edu/aandreo1/487/487Archive/Resources/CAD/Foundry/PolyMUMPS/PolyMUMPs_DR_v11.pdf",
    "title": "PolyMUMPs Design Handbook revision 11, MEMSCAP",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-polymumps-primary",
        "title": "PolyMUMPs Design Handbook revision 11, MEMSCAP",
        "url": "https://pages.jh.edu/aandreo1/487/487Archive/Resources/CAD/Foundry/PolyMUMPS/PolyMUMPs_DR_v11.pdf",
        "type": "original foundry handbook hosted by university",
        "checked": "2026-10-08",
        "read_scope": "Chapter 1 process and section 2.8 release/critical-point drying",
        "supports": [
          "Deposited polysilicon structures, sacrificial phosphosilicate oxide and nitride isolation have distinct functions; anchor openings, supported dicing, wet release and critical-point drying are explicit process obligations."
        ],
        "affected_outputs": [
          "mems-isolated-substrate-wafer",
          "mems-poly0-routing-wafer",
          "mems-sacrificial-stack-wafer",
          "patterned-inertial-wafer",
          "unreleased-inertial-die",
          "released-inertial-die",
          "mems-critical-point-dryer"
        ],
        "does_not_establish": [
          "Our single-structural-layer adaptation, cap integration, exact reagents/settings, first equipment construction, complete stiction elimination or smartphone accelerometer performance."
        ],
        "access_notes": "Official MEMSCAP revision 13 URL failed. Berkeley mirrors failed on direct open; original revision 11 on Johns Hopkins opened. No handbook numerical recipe settings adopted.",
        "independent_review_note": "Independent review correction: original handbook places metal after structural processing. Early feedthrough metal in this candidate has no established thermal compatibility or fabrication chronology; this is an explicit blocker, not a selected material/temperature solution.",
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://engineering.purdue.edu/oxidemems/conferences/transducers2009/PDFs/Papers/002_3002.pdf",
    "title": "Wafer level packaging of MEMS, Esashi, Transducers 2009",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json",
      "proposals/2026-10-08-discovery/research/mems/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-esashi-cavity-protection",
        "title": "Wafer level packaging of MEMS, Esashi, Transducers 2009",
        "url": "https://engineering.purdue.edu/oxidemems/conferences/transducers2009/PDFs/Papers/002_3002.pdf",
        "type": "original researcher conference paper",
        "checked": "2026-10-08",
        "read_scope": "Cavity/feedthrough introduction and glass-frit seal discussion",
        "supports": [
          "Moving structures need cavity protection and electrical access; glass-frit sealing can accommodate a lateral feedthrough; ordinary plastic molding cannot directly protect exposed moving mechanics."
        ],
        "affected_outputs": [
          "mems-feedthrough-patterned-wafer",
          "mems-frit-paste-stock",
          "mems-ring-coated-cap-die",
          "mems-cap-wafer",
          "accelerometer-mems-die",
          "accelerometer"
        ],
        "does_not_establish": [
          "Our die-level cap sequence, frit composition, hermeticity, thermal stress, feedthrough planarity, target damping pressure or accepted final package."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      },
      {
        "id": "mems-esashi-packaging",
        "title": "Wafer level packaging of MEMS, Esashi, Transducers2009",
        "url": "https://engineering.purdue.edu/oxidemems/conferences/transducers2009/PDFs/Papers/002_3002.pdf",
        "type": "original conference paper by process researcher",
        "read_scope": "Introduction; accelerator capping/interconnect examples; cavity-pressure section",
        "supports": [
          "Protected cap/shell cavity with electrical access",
          "Moving elements cannot be directly embedded in ordinary plastic molding",
          "Wafer capping/protection can precede dicing",
          "Cavity pressure for damping differs from universal vacuum requirement"
        ],
        "does_not_establish": [
          "Selected bonding chemistry for our die",
          "Exact required cavity pressure/leak rate",
          "Our dicing/release/bond chronology",
          "Qualified final package"
        ],
        "checked": "2026-10-08",
        "origin_file": "proposals/2026-10-08-discovery/research/mems/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified",
    "prior_status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.itl.nist.gov/div898/handbook/mpc/section3/mpc3.htm",
    "title": "Calibration, NIST Engineering Statistics Handbook",
    "title_verified": true,
    "topic": "electronics",
    "provenance": [
      "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
    ],
    "claim_scopes": [
      {
        "id": "frontier-nist-calibration",
        "title": "Calibration, NIST Engineering Statistics Handbook",
        "url": "https://www.itl.nist.gov/div898/handbook/mpc/section3/mpc3.htm",
        "type": "national metrology institute primary guidance",
        "checked": "2026-10-08",
        "supports": [
          "Calibration requires comparison against a reference or designated process and quantified uncertainty."
        ],
        "affected_outputs": [
          "calibration-standards",
          "electrical-reference-instrument",
          "meter",
          "dimensional-metrology"
        ],
        "does_not_establish": [
          "First physical realization of our length/electrical/mass/time/temperature references, transfer chain or instrument range/uncertainty."
        ],
        "origin_file": "proposals/2026-10-08-discovery/electronics/frontier-sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.trioptics.com/products/procam-camera-modules-active-alignment-and-testing",
    "title": "TRIOPTICS ProCam active alignment",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-trioptics-active",
        "url": "https://www.trioptics.com/products/procam-camera-modules-active-alignment-and-testing",
        "title": "TRIOPTICS ProCam active alignment",
        "supports": "Live sensor readout, multiple-axis lens/sensor positioning, target generation, dispensing and curing are parts of active alignment.",
        "limits": "Commercial apparatus demonstrates the architecture, not a bootstrap recipe, required precision or handset acceptance.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.edmundoptics.com/capabilities/precision-optics/capabilities/optical-coatings/",
    "title": "Edmund Optics optical coatings",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-edmund-coatings",
        "url": "https://www.edmundoptics.com/capabilities/precision-optics/capabilities/optical-coatings/",
        "title": "Edmund Optics optical coatings",
        "supports": "AR and spectral filter multilayers can be made by controlled vacuum deposition.",
        "limits": "Does not provide selected glass, oxide chemistry, layer recipe, machine construction or phone-level requirements.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.edmundoptics.com/knowledge-center/application-notes/lasers/anti-reflection-coatings/",
    "title": "Edmund Optics AR coatings",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-edmund-ar",
        "url": "https://www.edmundoptics.com/knowledge-center/application-notes/lasers/anti-reflection-coatings/",
        "title": "Edmund Optics AR coatings",
        "supports": "AR response depends on wavelength and incidence angle; multilayer designs have distinct spectral behavior.",
        "limits": "No adopted phone coating design or measured target acceptance.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.sony-semicon.com/en/products/is/mobile/index/text2.html",
    "title": "Sony mobile image sensor layer structures",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-sony-stack",
        "url": "https://www.sony-semicon.com/en/products/is/mobile/index/text2.html",
        "title": "Sony mobile image sensor layer structures",
        "supports": "Color filters, silicon photodiodes and interconnect are optical/electrical layers; frontside, backside and stacked architectures differ.",
        "limits": "This source does not establish our frontside process performance or a manufacturing recipe.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.sony-semicon.com/en/technology/mobile/rb2x2-ocl.html",
    "title": "Sony on-chip lenses",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-sony-ocl",
        "url": "https://www.sony-semicon.com/en/technology/mobile/rb2x2-ocl.html",
        "title": "Sony on-chip lenses",
        "supports": "On-chip lenses are coordinated with pixel structure.",
        "limits": "No prescription for proposed conventional polymer reflow process or modern capability.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://pages.rohm.com/motordrivers",
    "title": "ROHM motor driver circuits",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-rohm-driver",
        "url": "https://pages.rohm.com/motordrivers",
        "title": "ROHM motor driver circuits",
        "supports": "Actuation requires driver hardware, peripheral circuitry, interfaces and supply; simple bridges do not establish camera focus performance.",
        "limits": "Discrete camera drive below is a design hypothesis; closed-loop bandwidth/noise/size remain unknown.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://corporate.murata.com/en-us/technology/technology-applications/saw",
    "title": "Murata SAW structure and manufacturing",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-murata-saw",
        "url": "https://corporate.murata.com/en-us/technology/technology-applications/saw",
        "title": "Murata SAW structure and manufacturing",
        "supports": "SAW piezoelectric substrates carry lithographic interdigital electrodes, are diced and bonded to package substrates.",
        "limits": "Does not establish our crystal cut, metal stack, cavity sealing recipe or demanded filter bands.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://corporate.murata.com/en-global/technology/techmag/metamorphosis20/productsmarket/ihp-saw.",
    "title": "Murata SAW and BAW structures",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-murata-baw",
        "url": "https://corporate.murata.com/en-global/technology/techmag/metamorphosis20/productsmarket/ihp-saw.",
        "title": "Murata SAW and BAW structures",
        "supports": "Conventional BAW uses a piezoelectric layer between electrodes; SAW uses surface interdigital structures.",
        "limits": "Does not justify mixing BAW layers into the selected SAW route.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.qorvo.com/design-hub/technical-articles/baw-vs-saw-rf-filters",
    "title": "Qorvo BAW versus SAW",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-qorvo-baw",
        "url": "https://www.qorvo.com/design-hub/technical-articles/baw-vs-saw-rf-filters",
        "title": "Qorvo BAW versus SAW",
        "supports": "BAW layered structures and acoustic reflectors need thickness control; filter technologies differ.",
        "limits": "Architecture only; no chosen numerical band target or complete AlN deposition recipe.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.winfoundry.com/en-US/About/about_company",
    "title": "WIN GaAs foundry technology",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-winfoundry-hbt",
        "url": "https://www.winfoundry.com/en-US/About/about_company",
        "title": "WIN GaAs foundry technology",
        "supports": "GaAs HBT device fabrication includes epitaxial growth and device characterization.",
        "limits": "Foundry service is not an allowed physical input; epitaxy feed chemistry and process remain open.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.sciencedirect.com/science/article/pii/S0038110199000866",
    "title": "InGaP HBT technology for RF and microwave instrumentation",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-hbt-paper",
        "url": "https://www.sciencedirect.com/science/article/pii/S0038110199000866",
        "title": "InGaP HBT technology for RF and microwave instrumentation",
        "supports": "The reported HBT process uses MOCVD epitaxy, lithography and reactive etching.",
        "limits": "Historical instrumentation process is not a phone PA design or a from-nature recipe.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://docs.nordicsemi.com/r/bundle/nwp_033/page/wp/nwp_033/nwp_033_antenna_if_ex.html?contentId=vmEpFeFweTcYS4yybgrJyw",
    "title": "Nordic antenna interface example",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-nordic-antenna",
        "url": "https://docs.nordicsemi.com/r/bundle/nwp_033/page/wp/nwp_033/nwp_033_antenna_if_ex.html?contentId=vmEpFeFweTcYS4yybgrJyw",
        "title": "Nordic antenna interface example",
        "supports": "Matching placement and ground geometry interact with PCB stackup.",
        "limits": "Illustrative interface does not set flagship bands, dimensions or matching values.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.skyworksinc.com/-/media/8F2E4659780D4B42824A349CE7CB2D80.pdf",
    "title": "Skyworks mobile antenna tuning",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-skyworks-tuner",
        "url": "https://www.skyworksinc.com/-/media/8F2E4659780D4B42824A349CE7CB2D80.pdf",
        "title": "Skyworks mobile antenna tuning",
        "supports": "Antenna tuning includes impedance/aperture topology, switches, passive choices and control interface.",
        "limits": "No delivered tuner or selected component allocation is assumed.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.keysight.com/us/en/learn/hubs/measurement-fundamentals/network-analysis.html",
    "title": "Keysight network analysis calibration",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-keysight-vna",
        "url": "https://www.keysight.com/us/en/learn/hubs/measurement-fundamentals/network-analysis.html",
        "title": "Keysight network analysis calibration",
        "supports": "VNA error correction uses independently known standards and a defined reference plane including cable/fixture effects.",
        "limits": "Does not manufacture our first standards or establish demanded frequency/uncertainty.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://softwareservices.flir.com/FFY-U3-04S2/latest/40-Installation/DustProtection.htm",
    "title": "FLIR optical path dust protection",
    "title_verified": true,
    "topic": "camera-rf",
    "provenance": [
      "proposals/2026-10-08-discovery/camera-rf/sources.json"
    ],
    "claim_scopes": [
      {
        "id": "cr-flir-window",
        "url": "https://softwareservices.flir.com/FFY-U3-04S2/latest/40-Installation/DustProtection.htm",
        "title": "FLIR optical path dust protection",
        "supports": "Protective windows, filters, retention and dust control affect an image sensor optical path and focus.",
        "limits": "Industrial example does not prescribe a smartphone package or target cleanliness.",
        "origin_file": "proposals/2026-10-08-discovery/camera-rf/sources.json"
      }
    ],
    "status": "Selective claim check; complete recipe and suitability unverified"
  },
  {
    "url": "https://www.dunand.northwestern.edu/pdf/chastain2011.pdf",
    "title": "Metallurgical analysis of copper artifacts from Cahokia",
    "title_verified": true,
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