Accelerometer mechanical die
Bond diced silicon cap by the selected frit-ring method over released moving structure, establishing a protected cavity and feedthrough connections before package assembly Discovery hypothesis; acceptance remains open.
Research draftClosure: OpenInventory incomplete
Capability requirements and tolerances
Consumer-specific numerical targets, quantities and acceptance limits remain open or incompletely reviewed. No smartphone-grade suitability is claimed. Distinct capability tiers require their own making route and qualification.
Making steps · draft selected for navigation; not a validated fabrication specification.
Known Parts and Tools
The selected route supplies this page's inventory and the map's dependency links from one record. Further requirements may be missing; review flags do not prove physical suitability.
| Requirement | Role | Use | Relationship status |
|---|---|---|---|
| Released inertial die | Part | incorporated or consumed; allocation remains open | Cycle-checked; compatibility unknown |
| Sensor seal ring cap | Part | incorporated or consumed; allocation remains open | Cycle-checked; compatibility unknown |
| Sensor wafer bonding equipment | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Gas handling | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Argon stock | Part | incorporated or consumed; allocation remains open | Cycle-checked; compatibility unknown |
| Pressure instruments | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Temperature instruments | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Optical instruments | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Electrical instruments | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Cleanroom | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
| Handling assembly | Tool | incorporated or consumed; allocation remains open | Cycle-checked; compatibility unknown |
| Regulated power | Tool | reused during construction/verification | Cycle-checked; compatibility unknown |
Unselected candidate inventories · 1
These records expose known requirements and alternative or blocked hypotheses. They add no manufacturing links or selected discovery depth.
Form, release, inspect and singulate the selected mechanical structures from a patterned-inertial-wafer; topology and exact sequence remain hypotheses
Form, release, inspect and singulate the selected mechanical structures from a patterned-inertial-wafer; topology and exact sequence remain hypotheses
- Patterned inertial sensor wafer · part
- Wafer dicing equipment · tool
- Sensor release and drying equipment · tool
- Optical instruments · tool
- Electrical instruments · tool
- Cleanroom · tool
- Handling assembly · tool
- Regulated power · tool
- Cooling systems · tool
- Ventilation · tool
Complete inventory, selected process and compatible quantitative capability remain open. Wafer-level protection/capping versus release/dicing timing must be resolved before a recipe or physical output can be accepted.
Making outline
- Bond diced silicon cap by the selected frit-ring method over released moving structure, establishing a protected cavity and feedthrough connections before package assembly
- Build or acquire each explicit earlier physical input; establish independent references and interfaces.
- Make trials and accept only against the eventual caller specification; record uncertainty and rejected outputs.
What remains unresolved
- Discovery hypothesis only: quantitative demands, full recipe, quantities, losses, compatibility and acceptance remain to be researched.
- Release, protective capping, feedthrough formation and singulation order is unresolved; exposing released movable structures during wet dicing may be incompatible. Capping may need to precede dicing. Cavity pressure must be selected for the actual damping/acoustic demand, not universally vacuum.
- Full inventory, required quantities, process settings, numerical demand and suitability remain open.
- Attached bounded research supports investigation only; the selected inventory, process, quantitative demands and compatibility are not fully source-checked or approved.
Sources and leads
Source scope and research notes determine which claims have been checked. A URL does not establish a complete making route.
Earlier research provenance
- proposals/2026-10-08-discovery/electronics/report.md
- proposals/2026-10-08-discovery/electronics/frontier-report.md
Bounded research drafts
Read the source scope, known inventory and remaining limitations. These drafts do not approve the complete selected route.
- Read mems research (historical note unavailable)
Used by
Items that directly require this item in their selected inventory.
Paths from Smartphone
These routes together include every item that can lead from Smartphone to this item. Repeated path combinations are collapsed; recipes are omitted.
Shortest route: Smartphone → Sensor system → MEMS sensors → Motion sensor → Accelerometer → Accelerometer mechanical die
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